Daetec Adhesion Science PDC, Paper given at IMAPS 2015 in Orlando
John Moore and Alex Brewer taught a Professional Development Course (PDC) recently at the IMAPS 2015 conference in Orlando, Florida. Through hands-on learning, the different aspects and theory of adhesion science as well as temporary bonding concepts for wafers, displays and component/devices were reviewed.
Daetec gave a technical paper titled Substrate Temporary Bonding Supporting Post-Processing Applications. Different aspects of adhesion for temporary bonding were presented during the 3D Integration Materials and Processes track. Daetec also attended the Interactive Poster Session.